<br /> Lee Letter: b199

Washington and Lee University

Sender: Richard Henry Lee
Recipient: Thomas Jefferson

Dear Sir,

I am much obliged to you for your favor of January the 2d. with its enclosures which came to hand two days ago, kept back I suppose by the post. The Bearer who is Under Sherif of our county, will receive and bring me the Registers you are pleased to mention. A variety of preventions have concurred to delay my trip to Williamsburg, but I yet hope to have the pleasure of seeing you when the gout and weather will permit. I thank you Sir for your hint concerning Richmond, it will confirm a preconceived design I had of writing in time to secure lodging, as I do intend to go into the next Assembly. I hope the southern news is true, for such is the pride and obstinacy of our enemies that nothing but sound drubbing seems likely to bring them to reason. I have a letter from Dr. Lee dated 28 Septr. “The combined fleets of France & Spain will soon go out again, S as M. D’Orvilliers is dismissed from the command for M. Duchaffault, a more fighting Admiral is in his place, it is expected we shall have a better account of the English fleet this cruise, than the former” – by this I should conjecture that the combined fleets had returned to port without coming to action with the enemy & by extracts from the english papers, it would appear that Sr. Charles Hardy is vindicating himself to the nation for flying from the combined fleets, by pleading his orders – perhaps the British fled, and the Allies did not press upon them with approved vigor. My brother says, that “as he stands pledged for 300,000 livres for the State of Virginia, he is in doubt whether he will be permitted to come away ’till that is paid.” I hope Sir, that this business will not be suffered to add to the other persecutions of that ill-used gentleman! I am, with much esteem and regard,

dear Sir your friend & Servant.

Richard Henry Lee


Thomas Jefferson PapersLibrary of Congress

Printed in James Curtis Ballagh, The Letters of Richard Henry Lee, Volume 2, 1779 – 1794, pp. 174 – 75.