<br /> Lee Letter: b299

Washington and Lee University

Sender: Richard Henry Lee
Recipient: Thomas Lee Shippen

I have made such effectual inquiry after my dear Cousins stock buckle, that I have found it and safely deliverd it to my brother A. Lee. The world has assigned to you politeness equal to the good sense that distinguishes you – By what strange fatality then has it happened, that the concerns of a Lady have been neglected by you? I learn from Chantilly that a young Lady of that place had a pair of Set Shoe buckles committed to your care by her brother Thos. Lee some years ago to get repaired – And that to this day the workman has not made the necessary reparation! I thought that the Tradesmen in Philadelphia were more punctual – but this fellow has taken the advantage of your engagements in law study to neglect this business, which he would not have dared to do, if your piercing eye had been upon him –

Will you be pleased to recollect this matter and inform me in what Train it is – I suppose that our good friend Mr. Prager has delivered you the Guineas that I sent by him –

How proceeds the Leather covering for the Top & Sides of my Chariot, or have you yet met with an opportunity of sending it to Virginia? In the month of April, I suppose the Chair-Maker will commence his operation upon my most elegant, and strong, and every way complete Chair – Trunk, Box &c – I rely a good deal upon yours & my good friend the Doctors admonitions to the Artist, that he may be induced to exert his honest art most fully upon this little Machine – My Gun and Sword cannot forget that they are under your protection, and much want repair – God knows when I shall get away from this place, but I know, that if your Worthy father would honor me with his company here that the best Champaign should be plentifully at his call – God bless you and the whole family prays sincerely my dear Cousin

Your affectionate Uncle & friend.

Richard Henry Lee


Shippen Collection###

Printed in James Curtis Ballagh, The Letters of Richard Henry Lee, Volume 2, 1779 – 1794, pp. 340 – 41.