<br /> Lee Letter: n779

Washington and Lee University

Sender: Richard Henry Lee
Recipient: Pieter Johan Van Berckel

Sir,

I have the honour to send your excellency two letters that came under cover
from France.1 ‘Tis with pleasure I learn
from Mr. Adams, that it is probable the negotiations of this winter may
prevent the progress of hostilities in the spring, between the United
Netherlands, and the emperor. And also that the spirits of your
countrymen suffer no dejection, but that on the contrary, they are with
much diligence and wisdom composing party quarrels, and preparing for
the defence of the republic. Be so good as to present my compliments to
your son, and be assured that I am, with every sentiment of esteem and
regard sir,

your excellency’s most obedient servant,

Richard Henry Lee.

Notes:

MS not found; reprinted from Richard H. Lee, Memoir of the Life of Richard
Henry Lee and His Correspondence …, 2 vols. (Philadelphia: H.
C. Carey and I. Lea, 1825), 2:55.

1 Undoubtedly letters from C. W. F. Dumas to Congress of October 8 and 12,
1784, which were enclosed in an October 20 letter from John Adams
that was received this day. See Diplomatic Correspondence, 1783 – 89,
1:465 – 66, 3:519 – 24; and PCC, item 185, fol. 110.